SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
- Broadcom 7nm DSP ChipStable Transmission
- ≤10WLow Power Consumption
- 400GbpsHigh Bandwidth
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Optical Transceivers · OSFP-DR4-400G-Si
Generic Compatible 400GBASE-DR4 OSFP IHS/Finned Top 8 x 50G PAM4 1310nm 500m MPO-12/APC SMF SiPh-Based Transceiver Module
SiPhOSFP 400GDR4 500mIHS/Finned Top100G PAM4
Generic Compatible 400GBASE-DR4 OSFP IHS/Finned Top 8 x 50G PAM4 1310nm 500m MPO-12/APC SMF SiPh-Based Transceiver Module, Product Specification:Part Number - OSFP-DR4-400G-Si , Vendor Name - FS , Form Factor - Single-port OSFP IHS/Finned Top, Max Data Rate - 425Gbps (4x106.25Gb/s), Wavelength - 1310nm, Max. Cable Distance - 500m
Net price · DE
€1.043,00
ex. VAT
In stock
5-year warranty · Netcore-backed
Generic Compatible 400G DR4 OSFP PAM4 Silicon Photonics Optical Transceiver Module (SMF, 1310nm, 500m, MPO-12/APC, DOM, IHS/Finned Top)
The 400GBASE-DR4 silicon photonics module, MTP/MPO-12 connector, up to 500m over parallel single-mode fibre. It is compliant with OSFP MSA, CMIS 4.0 I2C Interface and 400GAUI-8 standards.
The 400 Gigabit Ethernet signal is carried over four parallel 1310nm optical lanes by one wavelength per lane. It can be used as 4x100G breakout to QSFP-DR-100G.
Note："Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7 and BlueField-3 DPUS.
The 400 Gigabit Ethernet signal is carried over four parallel 1310nm optical lanes by one wavelength per lane. It can be used as 4x100G breakout to QSFP-DR-100G.
Note："Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7 and BlueField-3 DPUS.
Highlights
- 01Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 10W
- 02SiPh-Based Technology for Lower Power, Cost and Higher Density
- 03Tested in Targeted Switches for Superior Performance, Quality, and Reliability
- 04Compliant with OSFP MSA, CMIS 4.0
- 05Support 4x100G Breakout to QSFP-DR-100G
- 06High-speed Electrical Compliant to IEEE 802.3bs
- 078x50G PAM4 Retimed 400GAUI-8 Electrical Interface
- 08Interoperable with Other IEEE-compliant 400GBASE Interfaces where Applicable
Specifications
26 fields| Part Number | OSFP-DR4-400G-Si |
| Vendor Name | FS |
| Form Factor | Single-port OSFP IHS/Finned Top |
| Max Data Rate | 425Gbps (4x106.25Gb/s) |
| Wavelength | 1310nm |
| Max. Cable Distance | 500m |
| Connector | MPO-12/APC |
| Media | SMF |
| Transmitter Type | DFB |
| Receiver Type | PIN |
| TX Power | -2.9~4.0dBm |
| Minimum Receiver Power | -5.9dBm |
| Power Budget | 3dB |
| Receiver Overload | 5.0dBm |
| Max. Power Consumption | 10W |
| Extinction Ratio | >3.5dB |
| DDM/DOM | Supported |
| Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Modulation (Electrical) | 8x50G-PAM4 |
| Modulation (Optical) | 4x100G-PAM4 |
| CDR (Clock and Data Recovery) | TX and RX |
| Inbuilt FEC | No |
| Core Size | 8.4~9.3um |
| Packaging Technology | COB |
| Protocols | IEEE 802.3bs, OSFP MSA, CMIS 4.0 |
| Warranty | 5 Years |
Features
Comprehensive Testing Increases Reliability
Qualified through a rigorous process with advanced equipments to ensure you get the high quality and reliable optics.
Different Connector Shells Match Different Devices
Distinguishing finned and flat tops, exploring differences in appearance and application.