Lossless Network with Roce-based Architecture
- FS provides the RoCE-based solution, delivering outstanding throughput, low-latency, and zero packet loss, ensuring efficient scalability for large-scale distributed applications.
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Optical Transceivers · OSFP-DR4-800G
Customized 800GBASE-DR4 OSFP224 IHS/Closed Finned Top 4 x 200G PAM4 1310nm 500m MPO-12/APC SMF Transceiver Module
Customized 800GBASE-DR4 OSFP224 IHS/Closed Finned Top 4 x 200G PAM4 1310nm 500m DOM MPO-12/APC SMF Optical Transceiver Module, Product Specification:Part Number - OSFP-DR4-800G, Packaging Technology - COB (Chip on Board) Packaging, Modulation (Electrical) - 4x 200G-PAM4, Modulation (Optical) - 4x 200G-PAM4, Inbuilt FEC - Yes, CDR (Clock and Data Recovery) - TX & RX Built-in DSP
Net price · DE
€1.328,00
ex. VAT
In stock
5-year warranty · Netcore-backed
Customized 800GBASE DR4 OSFP Optical Transceiver Module (SMF, 1310nm, 500m, MPO-12/APC, DOM, IHS/Closed Finned Top)
The 800GBASE-DR4 OSFP Optical Transceiver Module is designed for 800GBASE Ethernet throughput up to 500m over singlemode fibre (SMF) with MPO-12 connectors. This transceiver is compliant with IEEE 802.3dj, CMIS Rev 5.2, OSFP MSA. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parametres. It is suitable for 800G Ethernet, Data Center.
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
Highlights
- 01Built-in Broadcom DSP Chip, Max. Power Consumption 18W
- 02Parametre Tests for Superior Performance, Quality, and Reliability
- 03High-speed Connectivity Compliant to IEEE 802.3dj and CMIS Rev 5.2
- 04Hot Pluggable OSFP MSA Compliant
- 054x 200G PAM4 Retimed 800GAUI-4 C2M Electrical Interface
Specifications
8 fields| Part Number | OSFP-DR4-800G |
| Packaging Technology | COB (Chip on Board) Packaging |
| Modulation (Electrical) | 4x 200G-PAM4 |
| Modulation (Optical) | 4x 200G-PAM4 |
| Inbuilt FEC | Yes |
| CDR (Clock and Data Recovery) | TX & RX Built-in DSP |
| Protocols | IEEE 802.3dj, OSFP MSA, CMIS 5.2 |
| Warranty | 5 Years |