High Bandwidth, Low Power and Seamlessly Integrating
- 1600Gbps
- Seamlessly Integrating
- ≤30W
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Optical Transceivers · OSFP-DR8-1.6T-FL
Customized 1.6T 2 x DR4/DR8 OSFP224 RHS/Flat Top 8 x 200G PAM4 1310nm 500m Dual MPO-12/APC SMF Transceiver Module
200G PAM4 | InfiniBand | Broadcom 5nm | ≤30W
Customized 1.6T 2 x DR4/DR8 OSFP224 RHS/Flat Top 8 x 200G PAM4 1310nm 500m Dual MPO-12/APC SMF Transceiver Module, Product Specification:Part Number - OSFP-DR8-1.6T-FL, Vendor Name - FS, Form Factor - Twin-port OSFP RHS/Flat Top, Max. Data Rate - 1600Gbps, Wavelength - 1310nm, Max. Cable Distance - 500m
Net price · DE
€1.613,00
ex. VAT
In stock
Customized 1.6T OSFP 2xDR4/DR8 PAM4 Optical Transceiver Module (SMF, 1310nm, 500m, Dual MPO-12/APC, DOM, RHS/Flat Top)
This optical transceiver module is an InfiniBand 1.6T 2x 800Gb/s Twin-port OSFP RHS/Flat Top, 2xDR4/DR8 single mode, parallel, 8-channel transceiver using two, 2-fibre, 4-channel MPO-12/APC optical connectors at 800Gb/s each. The parallel single mode, short reach 8-channel (2xDR4/DR8), uses 200G-PAM4 modulation and has a maximum fibre reach of 500-metres using 8 single mode fibres. It is qualified for use in InfiniBand XDR end-to-end systems.
It is the ideal solution for supercomputing and HPC industries, seamlessly integrating into computing and storage infrastructure to ensure efficient high-performance interconnectivity. The RHS/Flat Top version is suitable for liquid-cooled switches.
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
It is the ideal solution for supercomputing and HPC industries, seamlessly integrating into computing and storage infrastructure to ensure efficient high-performance interconnectivity. The RHS/Flat Top version is suitable for liquid-cooled switches.
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
Highlights
- 01Qualified for InfiniBand XDR End-to-End Systems
- 02Built-in Broadcom 5nm DSP Chip, Max. Power Consumption 30W
- 03Up to 1600Gbps Aggregate Throughput
- 048x 200G-PAM4 Electrical to Dual 4x 200G-PAM4 Optical Parallel
- 05For High-Performance Computing (HPC) and Machine Learning (ML) Architectures
- 06Compliant with OSFP MSA, IEEE 802.3dj D1p3, RoHS, and Class 1 Laser Safety, with DDM Support
Specifications
24 fields| Part Number | OSFP-DR8-1.6T-FL |
| Vendor Name | FS |
| Form Factor | Twin-port OSFP RHS/Flat Top |
| Max. Data Rate | 1600Gbps |
| Wavelength | 1310nm |
| Max. Cable Distance | 500m |
| Connector | Dual MTP/MPO-12 APC |
| Media | SMF |
| Transmitter Type | EML |
| Receiver Type | PIN |
| TX Power | -3.3~4dBm |
| Minimum Receiver Power | -6.3dBm |
| Power Budget | 3dB |
| Receiver Overload | 4dBm |
| Max. Power Consumption | 30W |
| Extinction Ratio | ≥3.5dB |
| Modulation (Electrical) | 8x200G-PAM4 |
| Modulation (Optical) | Dual 4x200G-PAM4 |
| Packaging Technology | COB (Chip on Board) Packaging |
| Modulation Format | PAM4 |
| CDR (Clock and Data Recovery) | TX & RX Built-in DSP |
| Inbuilt FEC | No |
| Protocols | OSFP MSA Rev 5.1, CMIS Rev 5.3, IEEE 802.3dj D1p3, IEEE 802.3dj D1p3 |
| Warranty | 5 Years |